HBM IC Tester Latest Industry Trends: Revenue, Price, Sales Analysis Report 2025
Global Info Research‘s report is a detailed and comprehensive analysis for global HBM IC Tester market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Type and by Application. As the HBM IC Tester market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2025, are provided.
According to our (Global Info Research) latest study, the global HBM IC Tester market size was valued at US$ 94.26 million in 2024 and is forecast to a readjusted size of USD 154 million by 2031 with a CAGR of 6.5% during review period.
In this report, we will assess the current U.S. tariff framework alongside international policy adaptations, analyzing their effects on competitive market structures, regional economic dynamics, and supply chain resilience.
HBM IC Tester refers to a specialized semiconductor testing system designed for High Bandwidth Memory (HBM) integrated circuits. Since HBM is a 3D-stacked DRAM architecture connected through TSV (Through-Silicon Vias) and used alongside high-performance processors (such as GPUs, AI accelerators, and data center chips), its testing requires advanced IC testers that can validate both electrical performance and 3D packaging integrity. In 2024, global HBM IC Tester production reached approximately 350 units, with an average global market price of around US$ 260 K USD per unit. The production capacity for HBM IC Tester in 2024 was approximately 373 units. The typical gross profit margin for HBM IC Tester is between 30% and 40%.
The HBM IC Tester market focuses on testing solutions designed for High Bandwidth Memory (HBM) integrated circuits, which are widely used in AI accelerators, GPUs, data centers, and high-performance computing. These testers ensure the functionality, reliability, and performance of HBM stacks that integrate DRAM with logic dies through TSV (Through-Silicon Via) technology. The market is driven by the rapid expansion of AI training models, 5G, and cloud infrastructure, which require high-speed, high-capacity memory. Leading players include Advantest, Teradyne and Techwing, among others. Asia, particularly Korea, Taiwan, and China, holds a dominant share due to concentrated HBM production and semiconductor testing ecosystems. The market is expected to maintain strong growth as HBM adoption accelerates in next-generation AI chips and advanced packaging technologies.
This report is a detailed and comprehensive analysis for global HBM IC Tester market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2025, are provided.
Market segment by Type: Wafer-Level Tester、 Package-Level Tester
Market segment by Application:Artificial Intelligence (AI)、 Data Center、 High Performance Computing (HPC)、 Graphics Processing、 Others
Major players covered: Teradyne、 Advantest、 Techwing、 Cohu、 Keysight、 GSI Korea (Startest Electronics)、 Suzhou Secote Precision Electronic、 Shenzhen SEICHI Technologies、 Hangzhou Chang Chuan Technology
According to our (Global Info Research) latest study, the global HBM IC Tester market size was valued at US$ 94.26 million in 2024 and is forecast to a readjusted size of USD 154 million by 2031 with a CAGR of 6.5% during review period.
In this report, we will assess the current U.S. tariff framework alongside international policy adaptations, analyzing their effects on competitive market structures, regional economic dynamics, and supply chain resilience.
HBM IC Tester refers to a specialized semiconductor testing system designed for High Bandwidth Memory (HBM) integrated circuits. Since HBM is a 3D-stacked DRAM architecture connected through TSV (Through-Silicon Vias) and used alongside high-performance processors (such as GPUs, AI accelerators, and data center chips), its testing requires advanced IC testers that can validate both electrical performance and 3D packaging integrity. In 2024, global HBM IC Tester production reached approximately 350 units, with an average global market price of around US$ 260 K USD per unit. The production capacity for HBM IC Tester in 2024 was approximately 373 units. The typical gross profit margin for HBM IC Tester is between 30% and 40%.
The HBM IC Tester market focuses on testing solutions designed for High Bandwidth Memory (HBM) integrated circuits, which are widely used in AI accelerators, GPUs, data centers, and high-performance computing. These testers ensure the functionality, reliability, and performance of HBM stacks that integrate DRAM with logic dies through TSV (Through-Silicon Via) technology. The market is driven by the rapid expansion of AI training models, 5G, and cloud infrastructure, which require high-speed, high-capacity memory. Leading players include Advantest, Teradyne and Techwing, among others. Asia, particularly Korea, Taiwan, and China, holds a dominant share due to concentrated HBM production and semiconductor testing ecosystems. The market is expected to maintain strong growth as HBM adoption accelerates in next-generation AI chips and advanced packaging technologies.
This report is a detailed and comprehensive analysis for global HBM IC Tester market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2025, are provided.
Market segment by Type: Wafer-Level Tester、 Package-Level Tester
Market segment by Application:Artificial Intelligence (AI)、 Data Center、 High Performance Computing (HPC)、 Graphics Processing、 Others
Major players covered: Teradyne、 Advantest、 Techwing、 Cohu、 Keysight、 GSI Korea (Startest Electronics)、 Suzhou Secote Precision Electronic、 Shenzhen SEICHI Technologies、 Hangzhou Chang Chuan Technology
To Get More Details About This Study, Please Click Here: https://www.globalinforesearch.com/reports/2978374/hbm-ic-tester
The overall report focuses on primary sections such as – market segments, market outlook, competitive landscape, and company profiles. The segments provide details in terms of various perspectives such as end-use industry, product or service type, and any other relevant segmentation as per the market’s current scenario which includes various aspects to perform further marketing activity. The market outlook section gives a detailed analysis of market evolution, growth drivers, restraints, opportunities, and challenges, Porter’s 5 Force’s Framework, macroeconomic analysis, value chain analysis and pricing analysis that directly shape the market at present and over the forecasted period. The drivers and restraints cover the internal factors of the market whereas opportunities and challenges are the external factors that are affecting the market. The market outlook section also gives an indication of the trends influencing new business development and investment opportunities.
The Primary Objectives in This Report determine the size of the total market opportunity of global and key countries,assess the growth potential for HBM IC Tester and competitive factors affecting the marketplace,forecast future growth in each product and end-use market. Also,this report profiles key players in the global HBM IC Tester market based on the following parameters - company overview, sales quantity, revenue, price, gross margin, product portfolio, geographical presence, and key developments.
HBM IC Tester market is split by Type and by Application. For the period 2020-2031, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.
Market segment by region, regional analysis covers North America (United States, Canada, and Mexico),Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe),Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia),South America (Brazil, Argentina, Colombia, and Rest of South America),Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa).
The report provides insights regarding the lucrative opportunities in the HBM IC Tester Market at the country level. The report also includes a precise cost, segments, trends, region, and commercial development of the major key players globally for the projected period.
The HBM IC Tester Market report comprehensively examines market structure and competitive dynamics. Researching the HBM IC Tester market entails a structured approach beginning with clearly defined objectives and a comprehensive literature review to understand the current landscape. Methodologies involve a mix of primary research through interviews, surveys, and secondary research from industry reports and databases. Sampling strategies ensure representation, while data analysis utilizes statistical and analytical techniques to identify trends, market sizing, and competitive landscapes. Key areas of focus include trend analysis, risk assessment, and forecasting. Findings are synthesized into a detailed report, validated through peer review or expert consultation, and disseminated to stakeholders, with ongoing monitoring to stay abreast of developments.
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Global Info Research
Web: https://www.globalinforesearch.com
Email: report@globalinforesearch.com
CN: 0086-176 6505 2062
HK: 00852-58030175



